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Boron nitride. Acts as a filler. It exhibits hexagonal crystal structure and offers high thermal conductivity, excellent electrical insulation, high strength-to-weight ratio, as well as an excellent corrosion resistance. CarboTherm™ PCTP<sub>16</sub> is lubricious and non-abrading which greatly reduces wear on injection-molding and extruding equipment. It is non-toxic and offers low density, low surface area as well as low coefficient of thermal expansion. Recommended for thermoplastic polymers. Used in various applications such as custom-molded heat sinks on circuit boards, tubing for heat exchangers in appliances, insulation for high-speed rotating machine components, heat sink enclosures for LED bulbs, components for telecommunication devices, parts/enclosures for under-the-hood and electronic-component-units in automotive. Can also be used in compounding. It is suitable to be used for medium-volume, semi-automated loading systems. Boron nitride. Acts as a filler. It offers an optimum combination of thermal conductivity and mechanical performance. It exhibits high strength-to-weight ratio along with an excellent electrical insulation and corrosion resistance. CarboTherm™ PCTP<sub>30</sub>D is lubricious and non-abrading which greatly reduces wear on injection-molding and extruding equipment. It is non-toxic and offers low density, low surface area as well as low coefficient of thermal expansion. Recommended for thermoplastic polymers. Used in various applications such as custom-molded heat sinks on circuit boards, tubing for heat exchangers in appliances, insulation for high-speed rotating machine components, heat sink enclosures for LED bulbs, components for telecommunication devices, parts/enclosures for under-the-hood and electronic-component-units in automotive. Can also be used in compounding. It is suitable to be used for high-volume automated loading processes, allowing maximum throughput. Boron nitride. Acts as a filler. It exhibits high thermal conductivity, excellent electrical insulation, high strength-to-weight ratio, excellent corrosion resistance and recycling options. CarboTherm™ PCTF<sub>5</sub> is lubricious and non-abrading which greatly reduces wear on injection-molding and extruding equipment. It is non-toxic and offers low density, low surface area as well as low coefficient of thermal expansion. Recommended for thermoplastic polymers. Used in various applications such as custom-molded heat sinks on circuit boards, tubing for heat exchangers in appliances, insulation for high-speed rotating machine components, heat sink enclosures for LED bulbs, components for telecommunication devices, parts/enclosures for under-the-hood and electronic-component-units in automotive. Can also be used in compounding. It is suitable to be used for medium-volume, semi-automated loading systems. Boron nitride. Acts as a filler. It exhibits hexagonal crystal structure and offers high thermal conductivity, excellent electrical insulation, high strength-to-weight ratio, as well as an excellent corrosion resistance. CarboTherm™ PCTP<sub>30</sub> is lubricious and non-abrading which greatly reduces wear on injection-molding and extruding equipment. It is non-toxic and offers low density, low surface area as well as low coefficient of thermal expansion. Recommended for thermoplastic polymers. Used in various applications such as custom-molded heat sinks on circuit boards, tubing for heat exchangers in appliances, insulation for high-speed rotating machine components, heat sink enclosures for LED bulbs, components for telecommunication devices, parts/enclosures for under-the-hood and electronic-component-units in automotive. Can also be used in compounding. It is suitable to be used for medium-volume, semi-automated loading systems. Boron nitride. Acts as a filler. It is a low density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. It offers more efficient particle packing due to granular morphology and less interfacial resistance due to coarse low density grains, making it an ideal fit for applications that require through plane thermal conductivity utilizing low shear processing. CarboTherm® PCTL<sub>20</sub>MHF provides isotropic thermal performance, excellent dielectric strength, low density and low dielectric constant. Exhibits high lubricity which results in reduction of wear and tear of processing equipment. Used mainly in thermoset polymers. It is suitable to be used in potting/molding compounds and thermal interface materials. Can also be used in printed circuit board prepregs, gap fillers, compliant pads, solid state lighting/LEDs as well as electronics and power devices. CarboTherm™ CTS<sub>7</sub>M by Ceramic Materials (Saint-Gobain Group) is boron nitride. Acts as a filler. It exhibits non-abrading properties to enable gentle handling of critical electronic components. It provides high thermal conductivity, excellent dielectric strength, low density and low dielectric constant. Exhibits high lubricity which results in reduction of wear and tear of processing equipment. It is designed for thermoset polymers that utilize low shear processing where the highest thermal performance is required. CarboTherm™ CTS<sub>7</sub>M can be used in potting/molding compounds, thermal interface materials, printed circuit board prepregs, gap fillers, compliant pads, solid state lighting/LEDs as well as electronics and power devices. Boron nitride. Acts as a filler. It is a high density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. CarboTherm® PCTH<sub>7</sub>MHF provides high thermal conductivity, excellent dielectric strength, low density and low dielectric constant. Exhibits high lubricity which results in reduction of wear and tear of processing equipment. It provides isotropic thermal performance and enables high filler loadings. Used in thermoset polymers that utilize moderate shear processing. It is suitable to be used in potting/molding compounds and thermal interface materials. Can also be used in printed circuit board prepregs, gap fillers, compliant pads, solid state lighting/LEDs as well as electronics and power devices. Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to align with the direction of flow in polymer processing which makes it best fit for heat spreading applications such as three dimensional injection molding thermoplastics utilizing high shear processing. CarboTherm® CTP<sub>12</sub> provides high thermal conductivity, excellent dielectric strength, low density and low dielectric constant. Exhibits high lubricity which results in reduction of wear and tear of processing equipment. Used in potting compounds and thermal interface materials. Can also be used in printed circuit board prepregs, gap fillers, compliant pads, solid state lighting/LEDs as well as electronics and power devices. It is often utilized in cost demanding applications. Boron nitride. Acts as a filler. It is a low density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. It offers more efficient particle packing due to granular morphology and less interfacial resistance due to coarse low density grains, making it an ideal fit for applications that require through plane thermal conductivity utilizing low shear processing. CarboTherm® PCTL<sub>30</sub>MHF provides isotropic thermal performance, excellent dielectric strength, low density and low dielectric constant. Exhibits high lubricity which results in reduction of wear and tear of processing equipment. Used mainly in thermoset polymers. It is suitable to be used in potting/molding compounds and thermal interface materials. Can also be used in printed circuit board prepregs, gap fillers, compliant pads, solid state lighting/LEDs as well as electronics and power devices. Boron nitride. Acts as a filler. It offers non-abrading properties to enable gentle handling of critical electronic components. It exhibits platy lamellar structure similar to graphite and tends to align with the direction of flow in polymer processing which makes it best fit for heat spreading applications such as three dimensional injection molding thermoplastics utilizing high shear processing. CarboTherm® CTP<sub>30</sub> provides high thermal conductivity, excellent dielectric strength, low density and low dielectric constant. Exhibits high lubricity which results in reduction of wear and tear of processing equipment. Used in potting compounds and thermal interface materials. Can also be used in printed circuit board prepregs, gap fillers, compliant pads, solid state lighting/LEDs as well as electronics and power devices. It is often utilized in cost demanding applications.
CarboTherm™
Polymer additives supplied by Ceramic Materials (Saint-Gobain Group)