CarboTherm™ PCTL₃₀MHF

Boron nitride. Acts as a filler. It is a low density agglomerated powder which exhibits non-abrading properties to enable gentle handling of critical electronic components. It offers more efficient particle packing due to granular morphology and less interfacial resistance due to coarse low density grains, making it an ideal fit for applications that require through plane thermal conductivity utilizing low shear processing. CarboTherm® PCTL₃₀MHF provides isotropic thermal performance, excellent dielectric strength, low density and low dielectric constant. Exhibits high lubricity which results in reduction of wear and tear of processing equipment. Used mainly in thermoset polymers. It is suitable to be used in potting/molding compounds and thermal interface materials. Can also be used in printed circuit board prepregs, gap fillers, compliant pads, solid state lighting/LEDs as well as electronics and power devices.