3M™ Boron Nitride Cooling Filler Platelets CFP 007HS

3M™ Boron Nitride Cooling Filler Platelets CFP 007HS by 3M is powder of highly crystalline single platelets. It is ideal for thin films <50 µm due to its controlled top size. It is lightweight and offers highest reflectivity and increased in-plane thermal conductivity & electrical insulation. Exhibits low density, temperature stability, low loss factor and chemical resistance. It offers excellent heat spreading capabilities, excellent processability, high filler loadings and isotropic thermal conductivity. It is suitable for pads, potting resin and injection molded parts. It provides outstanding lubricating properties and is non-abrasive to tooling. 3M™ Boron Nitride Cooling Filler Platelets CFP 007HS is also suitable for thermoplastic, elastomer and thermoset resins. Recommended for thermal management in advanced polymers. It is used in automotive, electrical-, electronic devices & components. It registered in conformance with REACH according to EC directive 1907/2006.