Technical datasheet
3M™ Boron Nitride Cooling Filler Platelets CFP 0075
Supplied by3M- Last Updated on Apr 9, 2026
3M™ Boron Nitride Cooling Filler Platelets CFP 0075 by 3M is a lightweight, highly crystalline single platelets of boron nitride. Recommended for thermal management in advanced polymers. It offers high reflectivity & electrical insulation. It offers excellent heat spreading capabilities, excellent processability, high filler loadings and isotropic thermal conductivity. It is ideal for pads, potting resin and injection molded parts. Exhibits low density, temperature stability, low loss factor and chemical resistance. It provides outstanding lubricating properties and is non-abrasive to tooling. 3M™ Boron Nitride Cooling Filler Platelets CFP 0075 is suitable for thermoplastic, elastomer and thermoset resins. It is used in automotive, electrical-, electronic devices & components. It registered in conformance with REACH according to EC directive 1907/2006.
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3M™ Boron Nitride Cooling Filler Platelets CFP 0075 properties
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| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density, Bulk | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Particle Size Distribution, D10 | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Particle Size Distribution, D90 | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Particle Size Distribution, Median | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Surface Area | 0.0 Visible After Login | Visible After Login | Visible After Login |



