3M™ Boron Nitride Cooling Filler Platelets CFP 003SF

3M™ Boron Nitride Cooling Filler Platelets CFP 003SF by 3M is highly crystalline single platelets powder for thermal management in advanced polymers. It offers excellent heat spreading capabilities, excellent processability, high filler loadings and isotropic thermal conductivity. Exhibits low density, temperature stability, low loss factor and chemical resistance. It is lightweight and offers high reflectivity & electrical insulation. It is preferred for thin films <25 µm & fibers, fine channels, windings and has a controlled top size. It provides outstanding lubricating properties and is non-abrasive to tooling. It is ideal for injection molded parts. 3M™ Boron Nitride Cooling Filler Platelets CFP 003SF is suitable for thermoplastic, elastomer and thermoset resins. It is used in automotive, electrical-, electronic devices & components. It registered in conformance with REACH according to EC directive 1907/2006.