3M™ Boron Nitride Cooling Filler Platelets CFP 001

3M™ Boron Nitride Cooling Filler Platelets CFP 001 by 3M is powder of highly crystalline single platelets. It offers excellent heat spreading capabilities, excellent processability, high filler loadings and isotropic thermal conductivity. Exhibits low density, temperature stability, low loss factor and chemical resistance. It is lightweight and offers high reflectivity & electrical insulation. It is preferred for thin films <25 µm and fibers, fine channels and windings. It provides outstanding lubricating properties and is non-abrasive to tooling. It is ideal for injection molded parts. 3M™ Boron Nitride Cooling Filler Platelets CFP 001 is suitable for thermoplastic, elastomer and thermoset resins. It is used in automotive, electrical-, electronic devices & components and for thermal management in advanced polymers. It registered in conformance with REACH according to EC directive 1907/2006.