3M™ Boron Nitride Cooling Filler Agglomerates CFA 100

3M™ Boron Nitride Cooling Filler Agglomerates CFA 100 by 3M is randomly oriented agglomerates for high filler loadings and isotropic thermal conductivity. Its softness helps facilitate low impact on viscosity and easy processing that is less abrasive on equipment. Provides excellent heat transfer capabilities (through-plane). Exhibits low density, temperature stability, low loss factor and chemical resistance. It is lightweight and offers high reflectivity & electrical insulation. It can be added to potting resins, conformable thermal interface materials (TIM) foils or pads with bond lines of 150–200 µm. It is gentle on tooling for compounding, extrusion and injection molding processes. 3M™ Boron Nitride Cooling Filler Agglomerates CFA 100 is suitable for thermoplastic, elastomer and thermoset resins. It is used in automotive, electrical-, electronic devices & components and for thermal management in advanced polymers. It registered in conformance with REACH according to EC directive 1907/2006.