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EPO-TEK® OD2002 by Epoxy Technology is a thermal and electrically insulating, two component, optical epoxy resin. Provides high autoclave resistance and high glass transition temperature. Shows performance properties like rheology and conductivity. The syringe packaging will impact initial viscosity and effective pot life. It is suggested for use in endoscopes & general bonding for medical, fiber terminations to ferrules, optoelectronic packaging and hybrids. Complies with USP Class VI and ISO 10993 regulations. It has a pot life of 4 hours. The shelf life of EPO-TEK® OD2002 is 6 months at -40°C for syringe and 1 year at room temperature for bulk packaging. EPO-TEK® OE188 by Epoxy Technology is a two component, high temperature, low CTE, epoxy resin. It is capable of short cure cycles at low temperatures such as 80°C. Designed for semiconductor, fiber optic packaging and medical applications. EPO-TEK® OE188 has a pot life of 1.5 hours. The shelf life of this grade is 1 year at room temperature. EPO-TEK® OE138 by Epoxy Technology is a two component, epoxy resin which intermediate viscosity. It is cured at 150°C for 1 hour. Designed for medical and fiber optic applications. EPO-TEK® OE138 has a pot life of 2 hours. The shelf life of this grade is 1 year at room temperature. EPO-TEK® OE184 by Epoxy Technology is a two component, optically clear, epoxy resin with high glass transition temperature. Exhibits fast curing at 150°C for 1 hour. Designed for packaging and assembly of fiber optic cables and components. EPO-TEK® OE184 is suggested for termination of fibers into ferrules or fabrication of waveguide devices. It has a pot life of < 1 hour. The shelf life of this grade is 1 year at room temperature. EPO-TEK® OE121 by Epoxy Technology is a two component, optically clear, epoxy capillary grade with low stress. It is capable of curing at low temperatures in the range of 23°C to 80°C. Designed for semiconductor underfill and opto-device flip chip packaging. EPO-TEK® OE121 has a pot life of 5 hours. The shelf life of this resin is 1 year at room temperature. EPO-TEK® OE100-T by Epoxy Technology is a two component, epoxy resin which exhibits a high glass transition temperature. It is cured at 150°C for 1 hour. Designed for semiconductor, underfill, hard disk drive and hybrid micro-electronics packaging. EPO-TEK® OE100-T is also used in electronics, optical and medical devices. It has a pot life of 3 hours. The shelf life of this grade is 1 year at room temperature. EPO-TEK® OD1001 by Epoxy Technology is a thermal and electrically insulating, single component epoxy resin. Exhibits low glass transition temperature, several weeks of pot life and low modulus. Suitable for bonding ferrite cores in power device packaging. EPO-TEK® OD1001 is designed for low stress semiconductor and electronic packaging. It has a pot life of 28 days. The shelf life of this grade is 1 year at -40°C. EPO-TEK® OE175-2 by Epoxy Technology is a two component, high temperature, epoxy resin with improved wetting. Designed for semiconductor, hybrid, fiber optic and medical applications. EPO-TEK® OE175-2 has a pot life of 4 hours. The shelf life of this grade is 1 year at room temperature. EPO-TEK® OE101 by Epoxy Technology is a two component epoxy resin which exhibits low modulus. It is cured at 150°C for 1 hour. Designed for fiber optic packaging, opto-electronics and semiconductor applications. EPO-TEK® OE101 has a pot life of 4 hours. The shelf life of this grade is 1 year at room temperature. EPO-TEK® OE132-43 by Epoxy Technology is a single component, solvent containing polyimide grade. Designed high temperature applications found in semiconductor, hybrid, optical and medical devices. EPO-TEK® OE132-43 complies with REACH regulation. The shelf life of this resin is 1 year at room temperature.
EPO-TEK®
Plastics and elastomers supplied by Epoxy Technology
EPO-TEK® by Epoxy Technology are epoxy resins designed to address different performance needs such as electrical conductivity, thermal management, optical clarity, and rapid curing. They find use in the electronics industry for applications such as semiconductor packaging, microelectronics assembly, optoelectronics, and printed circuit board (PCB) assembly. They are also utilized in aerospace, automotive, medical devices, telecommunications, and optical systems.
Key benefits of EPO-TEK® brand include:
- Strong bonding strength
- Excellent chemical resistance
- Thermal stability
10 Products match your search
EPO-TEK® OD2002
by Epoxy Technology
EPO-TEK® OE188
by Epoxy Technology
EPO-TEK® OE138
by Epoxy Technology
EPO-TEK® OE184
by Epoxy Technology
EPO-TEK® OE121
by Epoxy Technology
EPO-TEK® OE100-T
by Epoxy Technology
EPO-TEK® OD1001
by Epoxy Technology
EPO-TEK® OE175-2
by Epoxy Technology
EPO-TEK® OE101
by Epoxy Technology
EPO-TEK® OE132-43
by Epoxy Technology
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