EPO-TEK® OD1001 by Epoxy Technology is a thermal and electrically insulating, single component epoxy resin. Exhibits low glass transition temperature, several weeks of pot life and low modulus. Suitable for bonding ferrite cores in power device packaging. EPO-TEK® OD1001 is designed for low stress semiconductor and electronic packaging. It has a pot life of 28 days. The shelf life of this grade is 1 year at -40°C.
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EPO-TEK® OD1001 properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Dielectric Constant | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dissipation Factor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Die Shear | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Hardness, Shore D | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Lap Shear | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Storage Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
Optical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Refractive Index | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Spectral Transmission | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Viscosity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Cure Time | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Particle Size | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Gravity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Thixotropic Index | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Weight Loss | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Weight Loss | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CLTE (Coefficent of Linear Thermal Expansion) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CLTE (Coefficent of Linear Thermal Expansion) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Degradation Temperature | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Glass Transition Temperature (Tg) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Operating Temperature (Continuous) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Operating Temperature (Intermittent) | 0.0 Visible After Login | Visible After Login | Visible After Login |