Technical datasheet

Tecnoflon® PFR 5910M

Supplied bySyensqo- Last Updated on Nov 14, 2024

Tecnoflon® PFR 5910M by Syensqo is a highly pure perfluoroelastomer (FFKM). It contains nanoparticles of polytetrafluoroethylene (PTFE) which acts as organic filler. It exhibits very good oxygen and fluorine plasma resistance, very low particle generation and low outgassing.
  • It shows excellent mechanical and sealing properties.
  • It offers low friction, high abrasion & chemical resistance and low modulus.
  • Suitable for dry (plasma etching, PECVD, LPCVD, metal CVD, PVD, ALD, plasma cleans) and wet semiconductor processes (wafer cleaning, polymer removal, wet etching, polishing).
  • Tecnoflon® PFR 5910M is designed for semiconductor manufacturing applications like chamber seals, lid seals, window seals, gas inlet seals, fitting seals, slit valve gates, lip seals and wafer handling parts.
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Tecnoflon® PFR 5910M properties

Mechanical properties

PropertiesValue & unitTest conditionTest method
100% Modulus0.0 Visible After LoginVisible After LoginVisible After Login
Compression Set0.0 Visible After LoginVisible After LoginVisible After Login
Elongation at Break0.0 Visible After LoginVisible After LoginVisible After Login
Hardness, Shore A0.0 Visible After LoginVisible After LoginVisible After Login
Maximum Torque (MH)0.0 Visible After LoginVisible After LoginVisible After Login
Minimum Torque (ML)0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Strength0.0 Visible After LoginVisible After LoginVisible After Login

Other properties

PropertiesValue & unitTest conditionTest method
Glass Transition Temperature (Tg), Midpoint0.0 Visible After LoginVisible After LoginVisible After Login
Glass Transition Temperature (Tg), Onset0.0 Visible After LoginVisible After LoginVisible After Login

Physical properties

PropertiesValue & unitTest conditionTest method
Cure Time (t'50)0.0 Visible After LoginVisible After LoginVisible After Login
Cure Time (t'90)0.0 Visible After LoginVisible After LoginVisible After Login
Density0.0 Visible After LoginVisible After LoginVisible After Login
Scorch Time (ts2)0.0 Visible After LoginVisible After LoginVisible After Login
Viscosity, Mooney0.0 Visible After LoginVisible After LoginVisible After Login

Thermal properties

PropertiesValue & unitTest conditionTest method
Brittleness Temperature0.0 Visible After LoginVisible After LoginVisible After Login
Temperature Retraction (TR10)0.0 Visible After LoginVisible After LoginVisible After Login

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