KetaSpire® KT-851 by Syensqo is a depth-filtered polyetheretherketone (PEEK) grade. Shows excellent chemical resistance to organics, acids and bases and best-in-class fatigue resistance. Exhibits ductility, flame retardancy, excellent wear resistance, ease of melt processing and high purity. It can be processed using injection molding, machining or profile extrusion. Offers the needed balance of properties and processability for applying thin insulation coatings onto copper or other conducting wire using a continuous extrusion process to achieve a robust insulation coating that is capable of withstanding the harsh use environments of many industrial applications. KetaSpire® KT-851 is suitable for applications such as electronics, oil/gas and wire jacketing.
Product family:
Chemical family:
Product Type:
| CAS Number | Visible After Login |
| Bio Based content | Visible After Login |
| Color | Visible After Login |
| Appearance | Visible After Login |
Compliance
| Certifications & Compliance | Visible After Login |
Applications
Recommended markets
Applications
Conversion mode
Availability
Product Status:Visible After Login
Regional Availability:Visible After Login| Visible After Login| Visible After Login
KetaSpire® KT-851 properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Dielectric Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Surface Resistance | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Compressive Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Elongation at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Elongation at Yield | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Elongation at Yield | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Hardness, Rockwell M | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Hardness, Shore D | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Shear Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Tensile Strength at Yield | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Transverse | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melt Mass-Flow Rate (MFR or MFI = Melt Flow Index or MI = Melt Index) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Gravity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity, Melt | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Glass Transition Temperature (Tg) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT), Annealed | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Peak Crystallization Temperature (DSC) (Crystalline Melt Temperature) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Heat Capacity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Heat Capacity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Thermal Conductivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
KetaSpire® KT-851 Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Front Temperature | Visible After Login | Visible After Login | |
| Middle Temperature | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
| Nozzle Temperature | Visible After Login | Visible After Login | |
| Rear Temperature | Visible After Login | Visible After Login | |
| Screw Compression ratio | Visible After Login | Visible After Login | |


