HTP-02-LI is a low density polyethylene compound. Contains a special metal deactivator and other additives to give good oxidation resistance in contact with copper and filling compounds. It has consistent polymer density in the acceptable range to retain maximum mechanical properties and resistance to the heat deformation. Gives ease of extrusion and a greater degree of toughness. Also provides excellent surface furnish and high output rates over a broad range of conditions. It has high resistance to copper catalyzed thermal oxidation and excellent resistance to petroleum jelly absorption. The combination of these properties offer stability for use as telephone signals insulation in air spaced and jelly filled cables and in environments subject to high temperature where insulation toughness is a requirement. It meets BS 6234: TYPE 03 and ASTM D 1248, TYPE I, CLASS A, CATEGORY 5, GRADE E 5 specifications.
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HTP-02-LI properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Dielectric Constant | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dissipation Factor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Tensile Elongation | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
Optical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Optical Imaging Technology | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Hardness, Shore | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Yield | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melt Mass-Flow Rate (MFR or MFI = Melt Flow Index or MI = Melt Index) | 0.0 Visible After Login | Visible After Login | Visible After Login |
HTP-02-LI Processing Guidelines
Extrusion Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Barrel - Zone 1 Temperature | Visible After Login | Visible After Login | |
| Barrel - Zone 2 Temperature | Visible After Login | Visible After Login | |
| Barrel - Zone 3 Temperature | Visible After Login | Visible After Login | |
| Barrel - Zone 4 Temperature | Visible After Login | Visible After Login | |
| Barrel - Zone 5 Temperature | Visible After Login | Visible After Login | |
| Conductor Pre-heating Temperature | Visible After Login | Visible After Login | |
| Die Head Temperature | Visible After Login | Visible After Login | |
| Line Speed | Visible After Login | Visible After Login | |
| Screw Diameter | Visible After Login | Visible After Login | |
| Screw Length | Visible After Login | Visible After Login | |

