SABIC

Technical datasheet

LNP™ THERMOCOMP™ Compound LC004XXP

Supplied bySABIC- Last Updated on Jun 10, 2024

LNP™ THERMOCOMP™ Compound LC004XXP by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin filled with 20% carbon fiber. This electrically conductive grade offers high stiffness, strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LC004XXP is recommended for electrical industry and electronic components such as mobile phones, computers and tablets. It is suitable for material handling.
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LNP™ THERMOCOMP™ Compound LC004XXP properties

Electrical properties

PropertiesValue & unitTest conditionTest method
Surface Resistivity0.0 Visible After LoginVisible After LoginVisible After Login

Mechanical properties

PropertiesValue & unitTest conditionTest method
Flexural Modulus0.0 Visible After LoginVisible After LoginVisible After Login
Flexural Yield Strength0.0 Visible After LoginVisible After LoginVisible After Login
Impact Strength, Notched Izod0.0 Visible After LoginVisible After LoginVisible After Login
Impact Strength, Unnotched Izod0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Strain0.0 Visible After LoginVisible After LoginVisible After Login

Other properties

PropertiesValue & unitTest conditionTest method
Tensile Strength at Yield0.0 Visible After LoginVisible After LoginVisible After Login

Physical properties

PropertiesValue & unitTest conditionTest method
Density0.0 Visible After LoginVisible After LoginVisible After Login
Linear Mold Shrinkage, Flow0.0 Visible After LoginVisible After LoginVisible After Login

LNP™ THERMOCOMP™ Compound LC004XXP Processing Guidelines

Injection Molding Processing Guidelines

PropertiesValue & unitTest conditionTest method
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Rear Zone 1 TemperatureVisible After LoginVisible After Login
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