Technical datasheet
LNP™ THERMOCOMP™ Compound JF004 (Asia)
Supplied bySABIC- Last Updated on Jun 10, 2024
LNP™ THERMOCOMP™ Compound JF004 (Asia) by SABIC is a compound based on PFAS-free, polyethersulfone (PES) resin reinforced with 20% glass fiber. It exhibits high stiffness, strength and temperature resistance. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound JF004 (Asia) is used in constructions, building components, consumer applications like personal accessory, electrical industry and electronic applications such as mobile phones, computers and tablets.
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LNP™ THERMOCOMP™ Compound JF004 (Asia) properties
Flammability properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flame Rating, UL 94 | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Stress | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Dart Drop | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Transverse | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Moisture Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT), Unannealed | 0.0 Visible After Login | Visible After Login | Visible After Login |