RENYCLE® S T203K 3030 BK by RadiciGroup is a toughened, impact modified, heat stabilized, partially recycled, 30% glass-fiber reinforced polyamide 6 (PA 6) grade. It contains release agent additive. It is suitable for processing by injection molding.
- It has been developed to reduce its environmental impact compared to first-choice grades through the recovery of post-consumer components.
- RENYCLE® S T203K 3030 BK is used in automotive, consumer industry goods, and transportation applications.
- It complies with RoHS 2011/65/EU.
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RENYCLE® S T203K 3030 BK properties
Flammability properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Automotive Interior Flammability | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Yield Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Nominal Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Tensile Strength at Yield | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melt Mass-Flow Rate (MFR or MFI = Melt Flow Index or MI = Melt Index) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Moisture Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
RENYCLE® S T203K 3030 BK Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Dew Point | Visible After Login | Visible After Login | |
| Drying Temperature | Visible After Login | Visible After Login | |
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| Melt Temperature | Visible After Login | Visible After Login | |
| Moisture Content | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |