RENYCLE® A T204K 3030 BK by RadiciGroup is a heat stabilized, toughened, impact modified, high-performance, recycled polyamide 66 (PA 66) reinforced with 35% glass-fiber. It contains a release agent additive. It is produced with selected feedstock coming from polymerization, yarn, and compounding plants.
- It is suitable for processing by injection molding.
- RENYCLE® A T204K 3030 BK is used in automotive, consumer industry goods, and transportation applications.
- It is RoHS 2011/65/EU compliant.
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RENYCLE® A T204K 3030 BK properties
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Nominal Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Tensile Strength at Yield | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Moisture Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
RENYCLE® A T204K 3030 BK Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Dew Point | Visible After Login | Visible After Login | |
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| Melt Temperature | Visible After Login | Visible After Login | |
| Moisture Content | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |



