WHISTATT OB43 by Otsuka Chemical is a low waste, modified polyphenylene ether (PPE) grade, reinforced with conductive filler DENTAL. Exhibits high dimensional stability, permanent conductivity, superior friction sliding and wear reduction. It is suitable for processing by injection molding. WHISTATT OB43 is recommended for silicon wafer baskets, IC trays and OA(gears).
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WHISTATT OB43 properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Elongation | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Linear Mold Shrinkage | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Gravity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT) | 0.0 Visible After Login | Visible After Login | Visible After Login |
WHISTATT OB43 Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Injection Pressure | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
| Tool temperature | Visible After Login | Visible After Login | |