Technical datasheet
Semitron® ESd 225
Supplied byMitsubishi Chemical Advanced Materials- Last Updated on Sep 6, 2018
Semitron® ESd 225 is a beige/tan colored static dissipative polyacetal, polyoxymethylene [POM] grade. Provides controlled bleed-off of static charges. Exhibits good wear resistance, thermal performance and dissipate static charges [5kV] in less than 2 seconds. Is suitable for processing by extrusion. Used in water combs, manufacturing & handling equipment of sensitive electronic components such as integrated circuits, hard disk drives and circuit boards. Suitable for material handling applications (silicon wafers) & components in high speed electronic printing and reproducing equipment.
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| Bio Based content | Visible After Login |
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Semitron® ESd 225 properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Dissipation Factor | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Surface Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Flammability properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flame Rating, UL 94 | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Limiting Oxygen Index (LOI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Compressive Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Compressive Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Compressive Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Hardness, Rockwell R | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Dielectric Constant | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Hardness, Ball Indentation | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Yield | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Absorption at Saturation | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Absorption at Saturation | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Maximum Service Temperature, Air | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Maximum Service Temperature, Air | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |