Masterbond Thermoset Epoxy

Technical datasheet

Supreme 3HTND-2DM

Supplied byMaster Bond- Last Updated on Jun 22, 2022

Supreme 3HTND-2DM by Master Bond is a toughened, one component epoxy (EP) system. Used as a barrier to block flow and for dam-and fill method for chip-on-board encapsulation. Exhibits good electrical insulation, long open time, good dimensional stability, high chemical and thermal cycling resistance. It has low ionic levels of chlorine, sodium and potassium. Recommended for vacuum, aerospace, electro-optic and semiconductor applications. It has a shelf life of 6 months. Supreme 3HTND-2DM meets RoHS and NASA Low Outgassing specifications.
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Supreme 3HTND-2DM properties

Electrical properties

PropertiesValue & unitTest conditionTest method
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Dielectric Strength0.0 Visible After LoginVisible After LoginVisible After Login
Volume Resistivity0.0 Visible After LoginVisible After LoginVisible After Login

Mechanical properties

PropertiesValue & unitTest conditionTest method
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Hardness, Shore D0.0 Visible After LoginVisible After LoginVisible After Login
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Modulus of Elasticity0.0 Visible After LoginVisible After LoginVisible After Login
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Other properties

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Thermal properties

PropertiesValue & unitTest conditionTest method
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Thermal Conductivity0.0 Visible After LoginVisible After LoginVisible After Login

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