EP21TDCSMed

EP21TDCSMed by Master Bond is a two component, silver filled, electrically conductive epoxy (EP) for bonding, sealing and coating. It offers convenient handling, high thermal conductivity, the ability to withstand thermal cycling and good strength properties.

• It is formulated to cure at room temperature or elevated temperatures with the optimum cure being overnight at room temperature followed by 2-3 hours at 150-200°F.
• It bonds well to a wide variety of substrates including metals, composites, glass, ceramics and many plastics.
• It has reasonably good strength in both shear and peel modes.
• It is specially formulated to be more forgiving than most epoxies and is capable of withstanding vigorous thermal cycling.
• It holds up very well to cleaning solutions and sterilants such as EtO and gamma radiation.
• It exhibits convenient mixing with a 1:1 weight ratio, contains no volatiles for excellent low outgassing properties, and allows for easy application with contact pressure curing, ensuring smooth and even spreading.
• It offers high bond strength to similar and dissimilar substrates, superior durability with thermal shock and chemical resistance, and is less rigid compared to conventional silver epoxy.
• EP21TDCSMed is used in medical electronic applications where superior conductivity and biocompatibility are important requirements.
• It has a shelf life of 3-6 months.
• It is RoHS complaint and USP Class VI certified.