Masterbond Thermoset Epoxy

Technical datasheet

EP21TCHT-1

Supplied byMaster Bond- Last Updated on Jun 22, 2022

EP21TCHT-1 is a two-component epoxy (EP) system by Master Bond. Offers low coefficient of thermal expansion, good thermal conductivity and electrical insulation. Exhibits high strength and resists heat and temperature. It is also cryogenically serviceable down to 4K. Also resists chemicals, such as water, oils, acids, bases and fuels. Suitable for aerospace, electronics, electrical, semiconductor and cryogenic applications. The shelf life of EP21TCHT-1 is 1 year. Meets RoHS, MIL-STD-810G for Fungus Resistance, NASA Low Outgassing specification and withstands 1000 hours at 85°C/85%RH humidity testing.
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EP21TCHT-1 properties

Electrical properties

PropertiesValue & unitTest conditionTest method
Dielectric Strength0.0 Visible After LoginVisible After LoginVisible After Login
Volume Resistivity0.0 Visible After LoginVisible After LoginVisible After Login

Mechanical properties

PropertiesValue & unitTest conditionTest method
Compressive Strength0.0 Visible After LoginVisible After LoginVisible After Login
Hardness, Shore D0.0 Visible After LoginVisible After LoginVisible After Login
Hardness, Shore D0.0 Visible After LoginVisible After LoginVisible After Login
Lap Shear Strength0.0 Visible After LoginVisible After LoginVisible After Login
Modulus of Elasticity0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Strength0.0 Visible After LoginVisible After LoginVisible After Login

Other properties

PropertiesValue & unitTest conditionTest method
Viscosity0.0 Visible After LoginVisible After LoginVisible After Login

Thermal properties

PropertiesValue & unitTest conditionTest method
CTE, Linear0.0 Visible After LoginVisible After LoginVisible After Login
Service Temperature0.0 Visible After LoginVisible After LoginVisible After Login
Thermal Conductivity0.0 Visible After LoginVisible After LoginVisible After Login

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