Masterbond Thermoset Epoxy

Technical datasheet

EP21BAS

Supplied byMaster Bond- Last Updated on Jul 18, 2023

EP21BAS by Master Bond is a two component, radiopaque epoxy system with more than 50% by weight of high purity ceramic, non-toxic filler. It is suitable for bonding, sealing, coating and encapsulation applications. It offers electrical insulation, dimensional stability, outstanding performance, good bonding strength and superior processability.
  • It provides high strength, durable bonds and resistance to many chemicals including water, oils, fuels, acids, bases and salts.
  • It is serviceable over the wide temperature range of -60°F to +250°F and adheres well to metals, glass, ceramics, wood, rubber, plastics.
  • It is easy to handle and cures readily at ambient temperatures and more quickly at elevated temperatures.
  • It offers superior durability and thermal shock resistance.
  • It is used in medical diagnostic and therapeutic devices to achieve optical visibility when exposed to x-rays, fluoroscopes or x-ray imaging procedures.
  • It has a shelf life of 6 months.
  • EP21BAS is RoHS complaint.
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EP21BAS properties

Electrical properties

PropertiesValue & unitTest conditionTest method
Dielectric Constant0.0 Visible After LoginVisible After LoginVisible After Login
Dielectric Strength0.0 Visible After LoginVisible After LoginVisible After Login
Volume Resistivity0.0 Visible After LoginVisible After LoginVisible After Login

Mechanical properties

PropertiesValue & unitTest conditionTest method
Hardness, Shore D0.0 Visible After LoginVisible After LoginVisible After Login
Modulus of Elasticity0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Elongation0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Lap Shear Strength0.0 Visible After LoginVisible After LoginVisible After Login
Tensile Strength0.0 Visible After LoginVisible After LoginVisible After Login

Thermal properties

PropertiesValue & unitTest conditionTest method
CTE, Linear0.0 Visible After LoginVisible After LoginVisible After Login
Service Temperature0.0 Visible After LoginVisible After LoginVisible After Login

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