DYNA-PURGE® C

DYNA-PURGE® C by Dyna-Purge is a clear, non-abrasive, non-chemical engineered thermoplastic purging compound, formulated to purge high clarity resins. A proprietary additive expands allowing for the purge to reach and clean all areas of the machine. The carrier matrix then flushes away the previous resin and other impurities, eliminating any “milky drag” or residue. It is a safe, non-hazardous, easy to use product that is excellent for transition to clear or transparent resin, preventative machine maintenance, and before manual cleaning. Also excellent for purging through hot runner systems, dies, or other downstream equipment and it is also effective through a wide temperature range (193°C-310°C). Thoroughly loosens carbonized and degraded resin, allowing it to be flushed out of the system and doesn’t require any process adjustment as it can be used at the resident resin processing temperature and RPM speed. It is suitable for PET, GPPS, PC, SAN, PMMA as well as other clear and transparent resins. It is processed by injection molding–cold and hot runners, extrusion–profile, cast film, sheet, compounding and blow molding. DYNA-PURGE® C complies with FDA CFR Title 21, Part 177, REACH and WEEE / RoHS.