E-TEC® PP 13579 by Colloids is an electrically conductive modified polypropylene polymer based on a dispersion of a conductive carbon black. Exhibits higher stiffness than other E-TEC® PP grades. It can be processed using injection molding. Designed for use as a compound at 100% addition rate. E-TEC® PP 13579 is recommended for rigid articles requiring a degree of permanent electrical conductivity such as tote boxes and other containers, such application find areas where the accumulation of static electrical charges on conventional polymers may cause problems, for example in the handling of static sensitive electronic devices or explosives. Complies with ISO 9001:2008 and ISO/TS 1649:2009.
| Bio Based content | Visible After Login |
Compliance
| Certifications & Compliance | Visible After Login |
Applications
Recommended markets
Conversion mode
Availability
Product Status:Visible After Login
E-TEC® PP 13579 properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Surface Resistance | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Elongation at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density, Bulk | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Melt Mass-Flow Rate (MFR or MFI = Melt Flow Index or MI = Melt Index) | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Heat Deflection Temperature (HDT) | 0.0 Visible After Login | Visible After Login | Visible After Login |
E-TEC® PP 13579 Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Pre-Drying Temperature | Visible After Login | Visible After Login | |
| Pre-drying Time | Visible After Login | Visible After Login | |
| Processing Temperature | Visible After Login | Visible After Login | |