Zytel® PLS95G35DH1EF BK314LM by Celanese is a high flow, heat stabilized polyamide 66 (PA 66) and polyamide 6T alloy reinforced with 35% glass fiber. It is a SHIELD protected polyamide resin for processing by injection molding. It is well suited for laser marking. It contains release agent and low halide content.
- It provides excellent surface appearance and exceptional resistance to hot air.
- Zytel® PLS95G35DH1EF BK314LM is recommended for electrical and electronics applications.
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Zytel® PLS95G35DH1EF BK314LM properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Comparative Tracking Index (CTI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Dielectric Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Flammability properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flame Rating, UL 94 | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Limiting Oxygen Index (LOI) | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Impact Strength, Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Poisson's Ratio | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Moisture Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity, Intrinsic | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Density, Melt | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity, Melt | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Water Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Glass Transition Temperature (Tg) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Heat Capacity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Thermal Conductivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Zytel® PLS95G35DH1EF BK314LM Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Ejection temperature | Visible After Login | Visible After Login | |
| Hold Pressure | Visible After Login | Visible After Login | |
| Hold Pressure Time | Visible After Login | Visible After Login | |
| Melt Temperature | Visible After Login | Visible After Login | |
| Melt Temperature | Visible After Login | Visible After Login | |
| Moisture Content | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
| Screw tangential speed | Visible After Login | Visible After Login | |