KEBAFORM C 901 CB by Barlog Plastics is an unreinforced, medium viscosity, electrically conductive, polyoxymethylene (POM) copolymer. It is processed by injection molding. This semi-crystalline grade offers high strength and high wear resistance. It exhibits dimensional stability, good chemical resistance and good gliding & electrical properties. KEBAFORM C 901 CB is used in controls, spring elements, plain bearing, media-carrying components, valves and gears. It targets automotive, household appliances, mechanical engineering and sanitary industries.
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KEBAFORM C 901 CB properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Contact Resistance | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Surface Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Breaking Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Elongation at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Charpy | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Transverse | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melt Mass-Flow Rate (MFR or MFI = Melt Flow Index or MI = Melt Index) | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
KEBAFORM C 901 CB Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Back Pressure | Visible After Login | Visible After Login | |
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Holding Pressure | Visible After Login | Visible After Login | |
| Injection Pressure | Visible After Login | Visible After Login | |
| Injection Speed | Visible After Login | Visible After Login | |
| Melt Temperature | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |