Technical datasheet
EnCom S PC 1614 R
Supplied byAurora Material Solutions- Last Updated on Feb 20, 2026
EnCom S PC 1614 R by Aurora Material Solutions is a polycarbonate (PC) grade with low coefficient of friction. It is available in black, natural or other colors. Is suitable for processing by injection molding. EnCom S PC 1614 R is recommended for cellular phone, business equipment and thin wall applications. Complies with UL 94 E-HB flame rating.
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EnCom S PC 1614 R properties
Flammability properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flame Rating, UL 94 | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Elongation at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Hardness, Rockwell R | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melt Mass-Flow Rate (MFR or MFI = Melt Flow Index or MI = Melt Index) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Specific Gravity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Heat Deflection Temperature (HDT), Unannealed | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT), Unannealed | 0.0 Visible After Login | Visible After Login | Visible After Login |
EnCom S PC 1614 R Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Back Pressure | Visible After Login | Visible After Login | |
| Drying Temperature | Visible After Login | Visible After Login | |
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| Melt Temperature | Visible After Login | Visible After Login | |
| Middle Barrel Temperatures | Visible After Login | Visible After Login | |
| Moisture Content (Max) | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
| Nozzle Temperature | Visible After Login | Visible After Login | |
| Rear Barrel Temperatures | Visible After Login | Visible After Login | |
| Screw Speed | Visible After Login | Visible After Login | |
| Suggested Shot Size | Visible After Login | Visible After Login | |
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