Polyketone (PK) for Plastic Parts

LNP™ THERMOCOMP™ Compound LX09404 by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin containing 45% carbon fiber. This electrically conductive grade displays high modulus, stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LX09404 is recommended for consumer & commercial appliances, electrical industry and electronic components, mobile phones, computers and tablets and material handling.

LNP™ THERMOCOMP™ Compound LF006E (Europe) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 30% glass fiber. It offers easy molding, good processability, high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF006E (Europe) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.

LNP™ THERMOCOMP™ Compound LF008 (Asia) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin which is filled with 40% glass fiber. It offers high modulus, stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF008 (Asia) is recommended for consumer & commercial appliances, electrical industry and electronic components, mobile phones, computers and tablets and material handling.

LNP™ THERMOCOMP™ Compound LF006EX1 by SABIC is a PFAS-free compound based on polyetheretherketone (PEEK) resin containing 30% glass fiber. It exhibits low warpage, high modulus, easy molding properties and high stiffness & strength, high temperature resistance and good processability. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound LF006EX1 is recommended for commercial appliance, consumer goods, electronic components, mobile phone, computer and tablets, electrical industry and material handling applications.

LNP™ THERMOCOMP™ Compound LC004XXP by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin filled with 20% carbon fiber. This electrically conductive grade offers high stiffness, strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LC004XXP is recommended for electrical industry and electronic components such as mobile phones, computers and tablets. It is suitable for material handling.

LNP™ THERMOCOMP™ Compound LF002 (Americas) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 10% glass fiber. It offers high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF002 (Americas) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.

LNP™ THERMOCOMP™ Compound LF004E (Europe) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 20% glass fiber. It offers easy molding, good processability, high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF004E (Europe) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.

LNP™ THERMOCOMP™ Compound LF006 (Europe) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 30% glass fiber. It offers high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF006 (Europe) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.

LNP™ THERMOCOMP™ Compound LF004E (Americas) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 20% glass fiber. It offers easy molding, good processability, high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF004E (Americas) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.

LNP™ THERMOCOMP™ Compound LF006 (Americas) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 30% glass fiber. It offers high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF006 (Americas) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.