Polyketone (PK) for Plastic Parts

LNP™ THERMOCOMP™ Compound LX09404 by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin containing 45% carbon fiber. This electrically conductive grade displays high modulus, stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LX09404 is recommended for consumer & commercial appliances, electrical industry and electronic components, mobile phones, computers and tablets and material handling.

POKETONE™ M330F by Hyosung is a high flow, low viscosity, semi-crystalline, aliphatic polyketone (PK) grade. It exhibits very high flow, good impact resistance, high resilience and good creep performance.

• It can also withstand short-term exposure to elevated temperatures.
• It possesses high resistance to hydrocarbons, solvents, salt solutions, weak acids and weak bases.
• It can be processed by injection molding.
• It has low cycle time and shows good mold definition with glossy mar resistant surfaces and low moisture sensitivity.
• POKETONE™ M330F is recommended for food contact applications, industrial and consumer appliance markets.
• The material is complaint to food contact regulation and drinking water regulation.
• Complies with EU 10/2011, NSF51, WRAS, RoHS, ISO 10993, NSF61, KTW/W270, ACS and USP Class VI.
• It has UL94 HB flame rating.

LNP™ THERMOCOMP™ Compound LF006EX1 by SABIC is a PFAS-free compound based on polyetheretherketone (PEEK) resin containing 30% glass fiber. It exhibits low warpage, high modulus, easy molding properties and high stiffness & strength, high temperature resistance and good processability. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound LF006EX1 is recommended for commercial appliance, consumer goods, electronic components, mobile phone, computer and tablets, electrical industry and material handling applications.

LNP™ THERMOCOMP™ Compound LF004E (Europe) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 20% glass fiber. It offers easy molding, good processability, high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF004E (Europe) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.

LNP™ THERMOCOMP™ Compound LF006E (Europe) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 30% glass fiber. It offers easy molding, good processability, high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF006E (Europe) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.

LNP™ THERMOCOMP™ Compound LF006 (Americas) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 30% glass fiber. It offers high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF006 (Americas) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.

LNP™ THERMOCOMP™ Compound LF008 (Asia) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin which is filled with 40% glass fiber. It offers high modulus, stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF008 (Asia) is recommended for consumer & commercial appliances, electrical industry and electronic components, mobile phones, computers and tablets and material handling.

LNP™ THERMOCOMP™ Compound LC008E (Americas) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 40% carbon fiber. This electrically conductive grade exhibits good processability, easy molding, high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LC008E (Americas) is recommended for electrical and electronic components such as mobile phones, computers and tablets. It is suitable for industrial material handling.

LNP™ THERMOCOMP™ Compound LF006 (Europe) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 30% glass fiber. It offers high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF006 (Europe) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.

LNP™ THERMOCOMP™ Compound LF002 (Americas) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 10% glass fiber. It offers high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF002 (Americas) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.