Polyketone (PK) for Plastic Parts

LNP™ THERMOCOMP™ Compound LF006EX1 by SABIC is a PFAS-free compound based on polyetheretherketone (PEEK) resin containing 30% glass fiber. It exhibits low warpage, high modulus, easy molding properties and high stiffness & strength, high temperature resistance and good processability. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound LF006EX1 is recommended for commercial appliance, consumer goods, electronic components, mobile phone, computer and tablets, electrical industry and material handling applications.

LNP™ THERMOCOMP™ Compound LF008 (Asia) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin which is filled with 40% glass fiber. It offers high modulus, stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF008 (Asia) is recommended for consumer & commercial appliances, electrical industry and electronic components, mobile phones, computers and tablets and material handling.

LNP™ THERMOCOMP™ Compound LF006E (Europe) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 30% glass fiber. It offers easy molding, good processability, high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF006E (Europe) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.

LNP™ STAT-KON™ Compound LX00486C by SABIC is a PFAS-free compound based on polyetheretherketone (PEEK) reinforced with carbon fiber. It has low ionics, outgassing and liquid particle count. It is suitable for processing by injection molding and LNP clean compounding technology. It provides high stiffness & strength, high heat resistance, good dimensional stability and electrical conductivity. LNP™ STAT-KON™ Compound LX00486C is designed for electrical industry, electronic components, mobile phones, computer and tablets.

LNP™ THERMOCOMP™ Compound LF006 (Europe) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 30% glass fiber. It offers high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF006 (Europe) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.

LNP™ THERMOCOMP™ Compound LC008E (Asia) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 40% carbon fiber. This electrically conductive grade exhibits good processability, easy molding, high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LC008E (Asia) is recommended for electrical and electronic components such as mobile phones, computers and tablets. It is suitable for industrial material handling.

LNP™ THERMOCOMP™ Compound LF002 (Americas) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 10% glass fiber. It offers high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF002 (Americas) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.

LNP™ THERMOCOMP™ Compound LC004XXP by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin filled with 20% carbon fiber. This electrically conductive grade offers high stiffness, strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LC004XXP is recommended for electrical industry and electronic components such as mobile phones, computers and tablets. It is suitable for material handling.

LNP™ THERMOCOMP™ Compound LF004E (Americas) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 20% glass fiber. It offers easy molding, good processability, high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LF004E (Americas) is recommended for consumer applications, commercial appliances, electrical industry and electronic components, mobile phones, computers, tablets and material handling.

LNP™ THERMOCOMP™ Compound LC006 (Europe) by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin that is filled with 30% carbon fiber. This electrically conductive grade exhibits high stiffness & strength and heat resistance. It is processed by injection molding. LNP™ THERMOCOMP™ Compound LC006 (Europe) is recommended for electrical and electronic components such as mobile phones, computers and tablets. It is suitable for industrial material handling.