High temperature PPA from BASF with flexible colorability for PCB connectors

Last update on May 26, 2026

PCB connectors and terminals for drive technology, power supply, and energy distribution face a converging set of demands: high-temperature resistance for reflow soldering, compliance with color-coding standards for safe assembly, dimensional stability under moisture and contamination, and compatibility with fully automated wiring processes.

BASF's Ultramid® Advanced N3U41 G6, a polyphthalamide (PPA) now selected by Weidmüller for its OMNIMATE® 4.0 product family, is designed to address these requirements within a single material solution.

You can review BASF's full product range in the Master Catalog of Plastics.

Reflow soldering compatibility and thermal performance

Ultramid® Advanced N3U41 G6 offers high temperature resistance suitable for reflow soldering, the process used to fasten electronic components to printed circuit boards. This positions it for use in high-performance electronics manufacturing where reflow compatibility is a baseline process requirement.

 

The laser-sensitive variant, Ultramid® Advanced N3U41 G6 LS, carries a UL-certified relative thermal index (RTI) of 150 °C, combines high heat resistance with low water absorption and strong electrical insulation properties, and incorporates a non-halogenated flame retardant – a relevant attribute for E&E applications where halogen-free compliance is a material selection criterion.

 

One of the more operationally significant attributes of Ultramid® Advanced N is its flexible colorability across RAL colors – including color-stable orange, blue, and green – while maintaining full UL Yellow Card certification across all colors. The relevant UL Yellow Cards apply to all colors under the all-color listing. This allows PCB component manufacturers to meet the color-coding requirements of the E&E industry for assembly and maintenance without managing separate certification processes per color variant. UL-certified masterbatches for self-coloring are also available.

 

"We are delighted that we were able to convince Weidmüller both with our high-performance material and with the wide range of colors available," says Andreas Stockheim from business management for PPAs at BASF. "BASF is the only company on the market offering customers a broad selection of pre-colored granules for this PA9T and other PPAs. It is also possible to use UL-certified masterbatches for self-coloring."

 

Looking for PPA grades that match your performance needs? Access technical data of 600+ grades and request samples directly in the Master Catalog of Plastics.

Dimensional stability and chemical resistance under service conditions

Power electronics components are increasingly exposed to moisture, dust, and contamination across a growing range of application environments. The material requirements for PCB components used in power electronics are, according to BASF, steadily increasing across a growing number of industries: materials must withstand higher temperatures, provide long-lasting electrical insulation, and maintain dimensional stability under challenging environmental conditions.

 

Ultramid® Advanced N3U41 G6 addresses these through its chemical resistance and dimensional stability profile. Its high comparative tracking index (CTI) of 600, measured according to IEC 60112, combined with reduced creepage distance, makes it suited for the miniaturization of electrical components where spacing between conductive parts is constrained.

 

The grade offers flowability comparable to liquid crystal polymer (LCP) and is supplied in a small granule size, which facilitates processing on smaller injection molding machines. This processability profile is relevant for manufacturers producing compact connector geometries where material flow into fine features is a production constraint. BASF reports that the grade's outstanding chemical resistance, dimensional stability, and very good processability contribute to the robustness and durability of finished components.

Supporting automation and cost efficiency in electronics manufacturing

The combination of material properties in Ultramid® Advanced N3U41 G6 is positioned to support the growing demands for automation and cost efficiency in the manufacturing of high-performance electronics. Weidmüller's OMNIMATE® 4.0 PCB components reflect this directly: they transmit power in a compact design, meet high voltage requirements, and use snap-in connection technology to enable fast, tool-free wiring – accelerating assembly and supporting fully automated wiring processes.

 

"Our OMNIMATE® 4.0 product family is ideally suited for fully automated wiring processes," says Johann Klippenstein, head of Device Connectors at Weidmüller. "The BASF PPA fits perfectly into this concept, as its mechanical and electrical properties remain at a high level even in small connectors. Combined with the exceptionally wide color palette, we offer our customers a safe solution that complies with DIN standard VDE 60335-1 and can be flexibly adapted to new requirements in high performance electronics."

 

You can review the full Ultramid® product range and compare grades by thermal, electrical, and processing properties directly in the Master Catalog of Plastics.

 

Image credits: BASF

Source
BASF