No data available

PHENODUR® PR 612/80B LF by allnex is a heat curable, phenolic resin. It does contain bisphenol A nor bisphenol F. It is preferably used as curing resin in combination with high molecular weight epoxide resins to formulate interior can coating systems. Also, used in electro & wire insulation varnishes and magnetic wire enamels. PHENODUR® PR 612/80B LF is used in phenolic/epoxide resin combinations, high-adhesion, chemically resistant protective coatings for apparatus, vessels and pipelines. Also, used in epoxy-free (= BADGE-free & BPA-NI) formulas with polyester resins. It can also be combined with food contact compliant polyester resins of DUROFTAL® product family to formulate BPA-NI coatings. It is delivered as 80% in n-butanol. Glycol ethers, esters, diacetone alcohol and ketones are suitable as solvents/diluents for this grade. The shelf life of this product is 730 days.
Product family:
Chemical family:
Product Type:
| Chemical Composition: | Visible After Login |
| Bio Based content | Visible After Login |
Documents related to PHENODUR® PR 612/80B LF
Compliance
No data available
Applications
Recommended markets
For which system
Availability
Product Status:Visible After Login
PHENODUR® PR 612/80B LF properties
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Free Formaldehyde Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Iodine Value | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Solid Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Viscosity | 0.0 Visible After Login | Visible After Login | Visible After Login |



