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Resin Solutions

Resin Solutions Solutions for Adhesives and Sealants

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Dymalink® 664

Aqueous zinc acrylate. It can be incorporated into water-based resins and cure activated using water-soluble peroxides, vazo initiators, and persulfates, as well as standard UV initiators. Has good heat stability, high flexibility, increased tear strength, improved tensile and modulus. It serves as a functional intermediate to enhance the performance of aqueous adhesives.

Dymalink® 634

Dymalink® 634 by Resin Solutions is a difunctional solid modified metallic dimethacrylate grade. It is suitable for adhesives. It is easy-to-handle and 100% reactive solid. This co-agent is an economical way to enhance the performance of variety of elastomers. Exhibits high modulus, tensile strength, elongation and crosslink density. Possesses hot tear strength, increased abrasion resistance and good hardness. Also offers fast cure response, greatly improved heat aging and resilience. Dymalink® 634 is recommended for use in peroxide cured systems requiring enhanced adhesion or dynamic properties.

Wingtack® Plus

Wingtack® Plus by Resin Solutions is an aromatically modified C-5 hydrocarbon resin. It is suitable for use hot-melt, solvent-borne and waterborne pressure sensitive adhesives such as low temperature tapes, carton sealing tapes, surgical tapes, bookbinding, EVA based HMA for non-woven assembly, general purpose hot-melt adhesives, elastomeric adhesives for nonwoven assembly and mastics general purpose. Wingtack® Plus acts as a tackifier and plasticizer. Offers benefits such as uniformity and consistency, oxidative stability, very low chloride levels, light color, low odor and specific gravity.

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