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Omyasphere

Adhesive ingredients supplied by Omya

12 Products match your search

Omya Hamburg

Omyasphere™ 220 TM-FQ

by Omya

Omyasphere 220 TM-FQ by Omya is a hydrophobic, lightweight, low-density filler. It is based on closed-cell expanded perlite. It possesses low density, high & consistent brightness, controlled top cut and less weight per volume unit of product applied. It exhibits improved thermal emittance, excellent sanding properties and improved storage stability. It provides lower environmental emissions in the transportation of finished goods, higher yield & processing. It offers savings on transportation costs by replacing conventional fillers such as silica sand. Omyasphere 220 TM-FQ is recommended for epoxy and polyester putties.
Omya Hamburg

Omyasphere™ 235 TM-FQ

by Omya

Omyasphere 235 TM-FQ by Omya is a hydrophobic, lightweight, low-density filler. It is based on closed-cell expanded perlite. It possesses low density, high & consistent brightness, controlled top cut and less weight per volume unit of product applied. It exhibits improved thermal emittance, excellent sanding properties and improved storage stability. It provides lower environmental emissions in the transportation of finished goods, higher yield and processing. It offers savings on transportation costs by replacing conventional fillers such as silica sand. Omyasphere 235 TM-FQ is suitable for tile adhesives.
Omya Hamburg

Omyasphere™ 235-FQ

by Omya

Omyasphere 235-FQ is a lightweight filler by Omya. It is based on closed-cell expanded perlite. Possesses low density, high & consistent brightness and controlled top cut. Exhibits faster tiling operations, improved workability and enhanced sag resistance. Offers lower environmental emissions in the transportation of finished goods along with cost savings and weight reduction at same spread rate. Provides density reductions, improved properties and faster application rates even at low dosage rates. Omyasphere 235-FQ is designed for high yield, thin bed ceramic tile adhesives and as a second choice in sealants.
Omya Hamburg

Omyasphere™ 938 S-CNZ

by Omya

Omyasphere™ 938 S-CNZ by Omya is a lightweight filler based on soda lime borosilicate glass. <br> <ul style="padding-left: 40px;"><li>It is spherical and hermetic microsphere with low density, high compressive strength and high brightness. </li> <li>Omyasphere™ 938 S-CNZ is used in adhesive and sealant application. </li></ul>
Omya Hamburg

Omyasphere™ 235 T-FQ

by Omya

Omyasphere 235 T-FQ by Omya is a low density, hydrophobic, lightweight, closed-cell expanded perlite-based filler. Exhibits faster tiling operations, improved workability and enhanced sag resistance. Offers lower environmental emissions in the transportation of finished goods along with cost savings and weight reduction at same spread rate. Recommended for high yield, thin bed ceramic tile adhesives and as a second choice in sealants. Provides density reductions, improved properties and faster application rates even at low dosage rates. Omyasphere 235 T-FQ has high & consistent brightness and controlled top cut.
Omya Hamburg

Omyasphere™ 220 T-FQ

by Omya

Omyasphere 220 T-FQ is a hydrophobic, lightweight, low density filler by Omya. It is based on closed-cell expanded perlite with high & consistent brightness and controlled top cut. Offers lower environmental emissions in the transportation of finished goods along with cost savings and weight reduction at same spread rate. Exhibits faster tiling operations, improved workability and enhanced sag resistance. Provides density reductions, improved properties and faster application rates even at low dosage rates. Omyasphere 220 T-FQ is used in high yield, thin bed ceramic tile adhesives and as a second choice in sealants.
Omya Hamburg

Omyasphere™ 928 S-CNZ

by Omya

Omyasphere™ 928 S-CNZ by Omya is a lightweight filler based on soda lime borosilicate glass. <br> <ul style="padding-left: 40px;"><li>It is spherical and hermetic microsphere with low density, high compressive strength and high brightness.</li> <li>Omyasphere™ 928 S-CNZ is used in putties, adhesive and sealant application.</li></ul>
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