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Omicure® U-24M by Huntsman is an aromatic substituted urea, intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It is suitable for encapsulation adhesives. The addition of Omicure® U-24M to epoxy/ dicy formulations reduces the time and/or temperature required to cure these shelf stable one part products. Suggested use level is < 5 phr. Omicure® U-410M by Huntsman is micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of curing. It provides great degree of acceleration to epoxy/dicy formulations. Omicure® U-410M is suitable for encapsulation adhesives. Suggested use level of is < 5 phr. Omicure® U-52M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It is reduces time and temperature of curing. It provides good acceleration, long shelf life and maintenance of cured properties to epoxy/dicy formulations. Omicure® U-52M is suitable for encapsulation adhesives. Suggested use level of is < 5 phr. Omicure® 24EMI by Huntsman is a non-crystallizing, low viscosity 2-ethyl-4-methyl imidazole. It is used an accelerator for anhydrides or as the sole hardener for catalytic cures of high temperature epoxy resin for laminating adhesives. It provides long pot life. It offers good oxidation aging and improved high temperature performance. It possesses low toxicity/less irritating and low cure temperature. Omicure® 24EMI gives very good adhesion to metal and glass and good dimensional stability of cured system. Omicure® DDA 5 by Huntsman is ultra micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and encapsulting compounds. Omicure® DDA 5 provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F epoxies and epoxy novolacs), with diluted or undiluted resins and with a wide variety of fillers and pigments. Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of curing. It provides long room temperature shelf life to epoxy/dicy formulations. Omicure® U-35M is suitable for encapsulation adhesives. Suggested use level is < 5 phr. Omicure® U-415M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of curing. It provides good acceleration, long shelf life and maintenance of cured properties in epoxy/dicy formulations. Omicure® U-415M is suitable for encapsulation adhesives. Suggested use level of is < 5 phr. Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of curing. It does not contain any chlorine. Omicure® U-405M is suitable for encapsulation adhesives. Suggested use level of is < 5 phr. Omicure® BC-120 by Huntsman is boron trichloride amine complex designed for adhesive applications. It is used as a latent curing agent and accelerator in the aromatic amine, acid anhydride or dicyandiamide cure of epoxy resins. Omicure® BC-120 is used in potting adhesives. Omicure® U-210 by Huntsman an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. Its addition to epoxy/ dicy formulations reduces the time and/ or temperature required to cure these shelf stable one part products. It is suitable for encapsulation adhesives. Suggested use level of Omicure® U-210 is < 5 phr.
Omicure®
Adhesive ingredients supplied by Huntsman