Omicure® U-210 by Huntsman an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. Its addition to epoxy/ dicy formulations reduces the time and/ or temperature required to cure these shelf stable one part products. It is suitable for encapsulation adhesives. Suggested use level of Omicure® U-210 is < 5 phr.
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Omicure® U-210 properties
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| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Melting Point | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Moisture Content | 0.0 Visible After Login | Visible After Login | Visible After Login |