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ORTEGOL® DA 801 by Evonik is a tailored dispersant for polyurethane based thermal interface materials. It has an excellent reduction of viscosity of PU formulations containing high loading of thermally conductive fillers. It has high affinity to aluminum-based fillers and hence ideally suited to disperse aluminum trihydroxide or aluminum oxide ORTEGOL® DA 801 has no impact on the reactivity of PU-based adhesives. It can be more easily applied between the cooling plate and battery modules which minimize the risk of defects in the thermal interface material such as holes or inadequate surface coverage. It also helps to break down larger filler agglomerates and allows a more even distribution of the filler which contributes to an improve thermal conductivity. It is essentially free of reactive hydroxyl (OH) groups. It does not interact with standard PU catalysts, ensuring that it has no adverse impact on the reactivity and curing behavior of PU-based adhesives. ORTEGOL® AP 100 by Evonik is an adhesion promoter ideally suited to use in 2K PU systems. It provides excellent adhesion to metal, plastic surfaces and works well in both foamed and compact PU systems. It is ideally suited to use in EV battery potting applications. The technical requirements for such potting materials typically include efficient filling, high adhesion, low density, high mechanical stabilization and elastic properties. ORTEGOL® AP 100 can be formulated into the polyol component or dosed as a separate component prior to application and also it is long-term stable and does not adversely affect the shelf life of the formulation.
ORTEGOL
Adhesive ingredients supplied by Evonik
2 Products match your search
ORTEGOL® DA 801
by Evonik
- Recently launched
ORTEGOL® AP 100
by Evonik
- Recently launched
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