ORTEGOL® DA 801

ORTEGOL® DA 801 by Evonik is a tailored dispersant for polyurethane based thermal interface materials. It has an excellent reduction of viscosity of PU formulations containing high loading of thermally conductive fillers. It has high affinity to aluminum-based fillers and hence ideally suited to disperse aluminum trihydroxide or aluminum oxide ORTEGOL® DA 801 has no impact on the reactivity of PU-based adhesives. It can be more easily applied between the cooling plate and battery modules which minimize the risk of defects in the thermal interface material such as holes or inadequate surface coverage. It also helps to break down larger filler agglomerates and allows a more even distribution of the filler which contributes to an improve thermal conductivity. It is essentially free of reactive hydroxyl (OH) groups. It does not interact with standard PU catalysts, ensuring that it has no adverse impact on the reactivity and curing behavior of PU-based adhesives.