Deox® 520 by Chitec Technology is a multi-functional antioxidant based on hindered phenol and thioether chemistry. Provides protection of substrate against thermal degradation.<br>
<ul style="padding-left: 40px;"><li>It can be used alone at low levels or together with phosphate-containing secondary antioxidants and benzofuranone.</li><li>Deox® 520 is used in adhesives and sealants.</li></ul>
Chivacure® 100 by Chitec Technology is a photoinitiator based on polyfunctional, oligomeric alpha-hydroxyketone. It exhibits high reactivity, non-migration, low odor and non-yellowing properties.<br>
<ul style="padding-left: 40px;"><li>It is compatible with most acrylic-based UV systems.</li>
<li>It is suitable for use in adhesives.</li>
<li>The recommended usage level of Chivacure® 100 is 0.5-5%.</li></ul>
Chivacure® 1176 by Chitec Technology is a cationic photoinitiator based on sulphonium chemistry. It is a blend of diphenyl(4-phenylthio)phenylsulfonium hexafloroatimonate and (thiodi-4,1-phenylene)bis(diphenylsulfonium) dihexafluoroatimonate. It is used to induce the polymerization of epoxides and other polymerizable materials on exposure to UV light.<br>
<ul style="padding-left: 40px;"><li>It generates a highly active protonic acid during photocleavage that can initiate a ring-opening polymerization of epoxy resins.</li>
<li>Chivacure® 1176 is designed for curing systems and adhesive applications.</li></ul>
