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Technicure®

Adhesive ingredients supplied by A&C Catalysts

18 Products match your search

Technicure® Nano-Dicy

by A&C Catalysts

Technicure® Nano-Dicy by A&C Catalysts is a pulverized grade of dicyandiamide, acts as a curing agent with an average particle size of about 1-2 micron. Provides excellent adhesion to a variety of substrates and has high glass transition temperature. Technicure® Nano-Dicy contains fumed silica to prevent clumping and improve flow.<br> <ul style="padding-left: 40px;"><li>Due to extremely fine particle size, it reacts more fully allowing a faster cure without sacrificing formulation shelf stability.</li> <li>Technicure® Nano-Dicy can be used with accelerators to lower temperature of initiation. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability.</li> <li>Used in composites such as pre-pregs, one-component adhesives for auto, aerospace and electronics applications.</li> <li>Recommended use level with epoxy resin is between 3-8 phr.</li></ul>

Technicure® DU-200M

by A&C Catalysts

Technicure® DU-200M by A&C Catalysts is a [1,1’- (4-methyl-m-phenylene)bis-(3,3-dimethyl)] urea, is a substituted urea. Technicure® DU-200M is a dicyandiamide (DICY) accelerator. Provides good formulation shelf stability, moderate glass transition temperature and excellent adhesion to a variety of substrates. The loading level of an accelerator will provide a balance of low temperature reactivity. Used in composites such as pre-pregs, one-component paste and film adhesives for automotive and aerospace applications. Recommended use level with epoxy resin (EEW=190) is 1-3 phr and with dicyandiamide between 3-8 phr.

Technicure® PDU-250

by A&C Catalysts

Technicure® PDU-250 by A&C Catalysts is n,n-dimethyl phenyl urea. It acts as curing agent and accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as an off-white powder. Technicure® PDU-250 provides fast curing, high glass transition temperature. It has applications in adhesives.

Technicure® D-5

by A&C Catalysts

Technicure® D-5 by A&C Catalysts is a dicyamdiamide which acts as curing agent. It appears as white to off-white powder. It is one of the finer of several pulverized grades of dicyandiamide containing more than 1% fumed silica as a flow control agent to inhibit clumping and improve flow. Technicure® D-5 is easily accelerated, has high glass transition temperature, and provides adhesion to a variety of substates. It is used in adhesives.

Technicure® IPDU-8

by A&C Catalysts

Technicure® IPDU-8 by A&C Catalysts is a N-3-(dimethylamino) carbonylaminomethyl-3,5,5-trimethylcyclohexyl-N,N-dimethyl-urea, is a substituted urea. Technicure® IPDU-8 is a dicyandiamide (DICY) cure accelerator. Offers latency and provides good formulation shelf stability, moderate glass transition temperature and excellent adhesion to a variety of substrates. Used in composites such as pre-pregs, one-component paste and film adhesives for automotive and aerospace applications. The loading level of an accelerator will provide a balance of low temperature reactivity. Recommended use level with epoxy resin is 1-3 phr and with dicyandiamide between 3-8 phr.

Technicure® D-44

by A&C Catalysts

Technicure® D-44 by A&C Catalysts. Dicyamdiamide acts as curing agent. It appears as white to off-white powder. It is one of the finer of several pulverized grades of dicyandiamide containing more than 1% fumed silica as a flow control agent to inhibit clumping and improve flow. Technicure® D-44 is easily accelerated, has high glass transition temperature, and provides adhesion to a variety of substates. It is used in adhesives.

Technicure® LC-80

by A&C Catalysts

Technicure® LC-80 by A&C Catalysts is a epoxy amine adduct. It acts as curing agent and accelerator for dicyandiamide, anhydrides, DDS or other imidazoles, decreasing the cure temperature. Technicure® LC-80 is a fine, free-flowing powder that can be used with epoxies. It is used for surface mount adhesives, induction cured hemming adhesives.

Technicure® MDU-11

by A&C Catalysts

Technicure® MDU-11 by A&C Catalysts is a 4,4’ Methylene bis (phenyl dimethyl urea). It acts as a curing agent and an accelerator for dicyandiamide. It is an aromatic, substituted urea-based accelerator that exists as an off-white powder. Technicure® MDU-11 provides fast curing, high glass transition temperature. It has applications in adhesives.

Technicure® EMI-24-CN

by A&C Catalysts

Technicure® EMI-24-CN by A&C Catalysts. It is a 1-(2-Cyanoethyl)-2-ethyl-4-methylimidazole and acts as an epoxy catalyst and curing agent. It appears as amber to brownish liquid. Technicure® EMI-24-CN is used for impact and heat resistant adhesives, and accelerator for anhydrides for example electrical encapsulation.

Technicure® DCMU

by A&C Catalysts

Technicure® DCMU by A&C Catalysts is a 3-(3,4-dichlorophenyl)-1,1-dimethylurea, is a substituted urea. Technicure® DCMU is a dicyandiamide (DICY) accelerator. Provides good formulation shelf stability, moderate glass transition temperature and excellent adhesion to a variety of substrates. Used in composites such as pre-pregs, one-component paste and film adhesives for automotive and aerospace applications. The loading level of an accelerator will provide a balance of low temperature reactivity. Recommended use level with epoxy resin is 1-3 phr and with dicyandiamide between 3-8 phr.
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