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Resicure™

Adhesive ingredients supplied by A&C Catalysts

3 Products match your search

Resicure™ EMI-24 LV

by A&C Catalysts

Resicure™ EMI-24 LV by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high chemical resistance, high glass transition temperature and rapid reactivity at temperature less than 100°C with 9-12 hours latency. Resicure™ EMI-24 LV is used in electrical potting and encapsulation, one-component adhesives for electronics applications. It is a lower viscosity version of Resicure™ EMI-24. Typical loading level as a sole curing agent in epoxy resin (EEW=190)is about 1-5 phr and as a dicy and anhydride cure accelerator is about 0.5 – 3.0 phr.

Resicure™ EMI-24

by A&C Catalysts

Resicure™ EMI-24 by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high chemical resistance, high glass transition temperature and rapid reactivity at temperature less than 100°C with 9-12 hours latency. Resicure™ EMI-24 is used in electrical potting and encapsulation, one-component adhesives for electronics applications. Typical loading level as a sole curing agent in epoxy resin (EEW=190)is about 1-5 phr and as a dicy and anhydride cure accelerator is about 0.5 – 3.0 phr.

Resicure™ 2-MI

by A&C Catalysts

Resicure™ 2-MI by A&C Catalysts is 2-methyl imidazole. It acts as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin-based formulations.<br> <ul style="padding-left: 40px;"><li>It offers high chemical resistance, high glass transition temperature and high reactivity at temperature less than 100°C.</li> <li>Resicure™ 2-MI is used in electrical potting & encapsulation, one-component adhesives for auto, aerospace and electronics applications.</li> <li>The recommended dosage level as a sole curing agent in epoxy resin (EEW=190) is about 3-5 phr and as a dicy & anhydride cure accelerator is about 0.5-1.5 phr.</li></ul>
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