Release Agents for Adhesives and Sealants

Silcolease® PC-107 by Elkem Silicones is a thermally curable, biocompatible, polyaddition silicone release coating. Acts as an easy release modifier. Silcolease® PC-107 is a milky-white emulsion containing medium vinyl content and a methyl hydrogen siloxane crosslinker. Exhibits good shear stability and excellent bath life even at high solids. Offers easy & increasing release surface at low stripping speeds & higher strip speeds respectively at low cure temperatures. It requires platinum catalyst emulsion also. Suitable for rubber-based & acrylic adhesives and other tacky materials such as pressure sensitive tapes and labels. Silcolease® PC-107, when properly used with Silcolease® PC-95 platinum catalyst, is currently permitted for direct and indirect food contact under Sections 21CFR175.320, 21CFR176.170 and 21CFR176.180 of the Federal Register.

DEUREX® E 11 B by Deurex is a non-polar polyethylene wax. Acts as a dispersing and release agent. DEUREX® E 11 B is suitable for use in hot-melt adhesives.

DEUREX® A 20 K by Deurex is an ethylene-bis-stearamide wax (EBS) grade. It acts as a dispersing and release agent. It is a temperature stable compound. It shows compatibility with polyvinylchloride (PVC). DEUREX® A 20 K is recommended for hot-melt adhesive applications. It complies with USA: FDA 21 CFR §§ 176.170, 175.300, 177.2470, 177.2480, 175.105 and 177.1200 regulations.

DEUREX® E 11 G by Deurex is a non-polar polyethylene wax. It acts as a dispersing and release agent. It's designed for the modification of hot-melt adhesive applications. It shows compatibility with polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), polycarbonate (PC) and polysulfide (PS). DEUREX® E 11 G complies with Regulation (EU) 10/2011, USA: FDA 21 CFR §§ 177.1520 (c), 21 CFR §§ 175.105 , 21 CFR §§ 175.300, 21 CFR §§ 176.170, 21 CFR §§ 176.180 and 21 CFR §§ 178.3720 for production of commodities intended to come in contact with food.

Silcolease® PC-188 by Elkem Silicones is a thermally curable, biocompatible, two-component polyaddition silicone release coating. Acts as an easy release agent. It is a milky-white emulsion containing methyl hydrogen crosslinker. It gives tighter release force performance in presence of a release modifier emulsion. Exhibits good shear stability and excellent bath life even at high solids. Offers a flat, easy & increasing release surface at low stripping speeds & higher strip speeds respectively at low cure temperatures. It requires platinum catalyst emulsion also. Suitable for styrene butadiene rubber (SBR) adhesives such as pressure sensitive tapes and labels. Silcolease® PC-188, when properly used with Silcolease® PC-95 platinum catalyst, is currently permitted for direct and indirect food contact under Sections 21CFR175.320, 21CFR176.170 and 21CFR176.180 of the Federal Register.

Solplus™ F100 by Lubrizol is an air release agent, defoamer, dispersion and wetting agent. It is based on the blend of polyurethane, epoxy, acrylic and unsaturated polyester. Solplus™ F100 is suitable for use in solvent-borne/ solvent-free adhesive systems.

BYK® -A 525 by BYK is a solution of a polyether-modified methyl alkyl polysiloxane copolymer. Acts as a release agent. In quartz-filled epoxy resins it shows excellent air release properties. Additionally, it improves the wetting of glass fibers. It is used to prevent air inclusions and porosity in epoxy and polyurethane systems. BYK® -A 525 is recommended level is 0.1 - 0.5% based upon total formulation.

BYK® -A 530 by BYK is a solution of foam-destroying polymers and polysiloxanes. Acts as a air release agent. It prevents foaming during manufacture and application of epoxy resin systems, so that blister- and pinhole-free systems with smooth surfaces are achieved. BYK® -A 530 is recommended for epoxy systems and also suitable for PUR systems. Its recommended level is 0.5 - 2 % additive based upon total formulation.

BYK® -A 555 by BYK is a solution of foam-destroying polymers, silicone-free. Acts as an air release agent. It shows a good efficiency in various adhesive applications. It should be stirred into the resin prior to the addition of other formulation components. Used in solvent-borne and solvent-free adhesives. It is suitable for epoxy systems and PUR systems. BYK® -A 555 recommended level is 0.1 - 0.5% based upon total formulation.

CARBOWAX™ Polyethylene Glycol (PEG) 3350 3350 by Dow is PEG-75-based plasticizer and mold release agent. It possesses lubricity and humectant properties and maintains wet-tack strength.

• CARBOWAX™ Polyethylene Glycol (PEG) 3350 is used in pressure-sensitive and thermoplastic adhesives.