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NISSOCURE® TIC-188 by Nippon Soda acts as an inclusion catalyst using imidazole as guest molecules as well as curing agent for epoxy resins. It is stable at room temperature, has a longer pot life. NISSOCURE® TIC-188 is used in epoxy molding compounds for semiconductor packages.
NISSOCURE®
Polymer additives supplied by Nippon Soda
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NISSOCURE® TIC-188
by Nippon Soda
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