EFOX 160 by AKPA Kimya is a curing agent. It possesses low activation temperature and relatively long pot life at ambient temperatures. This additive shows high reactivity at elevated temperature. It is mostly used in combination with a low reactive peroxide to ensure a good final cure. It is suitable for highly filled methacrylic resins, typically in combination with other curing agents of different reactivity, e.g. EFOX 30 (TBPB), AKPEROX PK 295 S50 or EFOX 10. EFOX 160 is used where a long gel time is required at room temperature in combination with a fast cure at elevated temperatures of 60°C to 140°C. It is ideal for cure-in-place-pipe (CIPP), pultrusion and filament winding. The recommended dosage level for this product is 1.0-2.0 phr and 0.5-1.0 phr as kicker. The shelf life of this additive is 3 months.
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EFOX 160 properties
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| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Active Oxygen Content | 0.0 Visible After Login | Visible After Login | Visible After Login |
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| Self Accelerating Decomposition Temperature (SADT) | 0.0 Visible After Login | Visible After Login | Visible After Login |
