Conductive Fillers & Fibers for Plastic Compounds

StanoStat A20W by Keeling & Walker is antimony-doped tin oxide, conductive filler. This aqueous colloidal dispersion is used for near-infrared absorbing polymer films. It provides high electrical conductivity and excellent absorption of infrared light at an excellent price to performance ratio. It is used for reheating applications in PET processing, 3D printing or powder sintering. StanoStat A20W is suitable for high end solar control films for automotive & residential applications, or in agricultural films.

StanoStat CPM10C by Keeling & Walker is a non-flammable, infrared filter. This antimony doped tin oxide is designed as a conductive filler which may be milled to an ultrafine particle size. StanoStat CPM10C provides electrically conductive and infrared reflective/absorptive properties. It is available as a blue powder or as nano dispersion.

ACPS high solid distributed by DKSH is a special blend of ultra-high exfoliated graphite/NPG and carbon black present in a paste form. It is easy to disperse in polyester resins (UPUR) and epoxy vinyl ester (EVER) and imparts thermal and electric conductivity.

• It allows reaching the system's percolation threshold at low dosage levels.
• Recommended dosage level is 3-6% over resin.
• ACPS high solid has a shelf life of 12 months.
• This product is available in Asia Pacific markets and North America.

ENSACO® 250 G by Imerys is a conductive carbon black-based filler. It has a low surface area & high structure and is available in the form of granules as well as powder. It enables resistance to shear, conductivity. It shows very good purity and excellent electrical/mechanical balance. It offers very good dispersibility, excellent surface smoothness and very low water absorption. ENSACO® 250 G is suitable for electronic components, films, automotive industry, transport, computer, health, antistatic flooring, heating element, sensors, PTC switch, UV protection and pigmentation. It provides easy compounding and processing with high extrusion throughput. It is recommended for HDPE, PP, LDPE, PC, non-conducting applications, few conductive compounds such as seals, shoe soles, NBR conductive hose compounds and CR conveyor belts. It is used in semicon compounds (EEA/EBA) for conductor and easily strippable insulation shields (blends of EVA and NBR).

NC7000™ by Birla Carbon is a thin multi-wall carbon nanotube produced via the catalytic carbon vapor deposition (CCVD) process. It is non-migrating, conductive additive for protection against electrical damage. It provides lowest particulate/dust emission, outgassing, non-volatile residue, and lowest ionic contamination. It contains no amide, DOP, or silicon oil.

• It ensures improved abrasion resistance, higher conductivity, and better static charge dissipation.
• Its low amount allows highest mechanical properties and optimal processability.
• It exhibits high cleanliness standards for IC, HDD, camera, and display applications.
• It can be compounded into all thermoplastics (HIPS, PP, MPPO, PC, PEEK, PEI).
• It can be used for packaging for the transport and storage of sensitive electric & electronic components that requires an electrically conductive material to avoid damage by electrostatic charges accumulation.
• NC7000™ is used in applications requiring low electrical percolation threshold such as high performance electrostatic dissipative plastics.
• It is also suitable for thermoformed trays, carrier tapes, injected carriers, small parts.

Boron nitride. Acts as a filler. It is a high purity single crystal grade with a very low surface area. This combination of features makes PT110 an outstanding filler that may improve the thermal conductivity of polymer resins, as it can be loaded to high levels and still give good flow performance. It is non wetting, lubricious, inert and chemically stable thermal conductor and electrical insulator. Has low dielectric constant/loss and high temperature stability. It may offer benefits to a variety of electronics applications. Potential uses include, but are not limited to phase change thermal interface materials, tapes, films and pads, thermal greases or gels, potting, encapsulants and thermally conductive plastics.

TIMREX® KS 6 Graphite by Imerys is a graphite-based filler. It shows low friction, chemical inertness and absence of inherent abrasiveness and film-forming ability on metal surfaces. It exhibits a relatively inoffensive nature of both powders and products of combustion. Due to the low aspect ratio of the particle shape, they combine good lubricating properties and electrical conductivity with excellent processability. TIMREX® KS 6 Graphite is suitable for processes such as extrusion or injection molding. It is used in thermoplastics, thermoset resins, PTFE and elastomers.

TIMREX® KS 44 Graphite by Imerys is a carbon graphite-based filler. Due to the low aspect ratio of the particle shape, it combines good lubricating properties and electrical conductivity with excellent processability. It is used in PTFE, thermoplastics, thermosets and elastomers. TIMREX® KS 44 Graphite is suitable for processes such as extrusion or injection molding. It shows low friction, chemical inertness and absence of inherent abrasiveness and film-forming ability on metal surfaces. It exhibits a relatively inoffensive nature of both powders and products of combustion.

SN-100P by Ishihara Sangyo Kaisha acts as an electro-conductive filler. It is composed of antimony-doped tin oxide (SnO₂/Sb) with a particle size of approximately 0.02 µm. It contains ultrafine electro-conductive particles of tin oxide.

• SN-100P shows excellent electro-conductivity and transparency.
• It can also be used for heat-shielding applications due to its excellent near-infrared absorption properties.

Boron nitride. Acts as a conductive filler. It is a high-purity single crystal grade. It is of low surface area and high crystallinity. Offers high thermal conductivity, high temperature stability and low coefficient of friction. Gives low viscosity in a polymer resin. It is non-wetting, lubricious, inert and chemically stable. Compatible with epoxy, epoxide resins, thermoset polyurethane resins and other thermosets. Recommended for various electronic applications like printed circuit board pre-pregs and laminates.