Low oil bleed, optical-grade thermal gel for high-speed electronics by Dow
Last update on Jun 4, 2026
Dow introduced DOWSIL™ TC-3120 Thermal Gel, positioning it for modules where heat density and optical cleanliness both constrain the design.
According to Dow, the gel reaches a thermal conductivity of approximately 12 W/m·K, the highest among the company's commercially available silicone gels. It is formulated to minimize oil bleeding and condensed outgassing, two contaminants that can reduce the reliability of optics and electronics.
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Designed to withstand high temperatures and humidity
Dow reports the material targets 800G and 1.6T optical modules, high-speed data applications, and dense electronics, with named uses including optical transceivers, telecommunications hardware, electronic module assemblies, autonomous vehicles, and automotive electronic controllers. The supplier describes it as a one-part, reworkable, flowable paste that can be pressed to a minimum bond line thickness of 200 µm, with cure accelerated by heat.
For engineers weighing ultra-high-conductivity options, Dow notes a processing distinction: although the gel is highly loaded with thermally conductive fillers, the company states it remains readily dispensable and supports controlled extrusion rates, behavior Dow describes as unusual among ultra-high-K materials, which often release silicone oil and can be difficult to hold at a consistent bond line.
Dow further states the material is designed to withstand high temperatures and humidity, shock and vibration, and repeated thermal cycling, and that it resists cracking, slumping in vertically oriented modules, and displacement under mechanical stress. The company recommends module-to-heatsink interfaces with tolerance stackups or uneven surfaces.
"DOWSIL™ TC-3120 Thermal Gel maximizes thermal transfers without sacrificing reliability, especially in optical and high-speed data applications," said Cathy Chu, Global Strategic Marketing director, Consumer & Electronics, Dow. "It is also highly efficient to process."
The gel joins Dow™ Cooling Science, the company's system-level approach to thermal management. According to Dow, it is available globally.