Technical datasheet
iPOLYCOND ECP 9604
Supplied byTBA Protective Solutions- Last Updated on Aug 6, 2025
iPOLYCOND ECP 9604 by TBA Protective Solutions is an electrically conductive, multi-walled carbon nanotube polycarbonate and polybutylene terephthalate (PC + PBT) alloy, reinforced with synergistic hybrids of low levels of steel fibers. Exhibits non-sloughing molds, very high EMI shielding, physical properties, excellent cleanliness and excellent dimensional- & chemical stability. Offers very good toughness for housings with UV resistance. iPOLYCOND ECP 9604 is suitable for processing by injection molding. Used in electronics industry (eg. storage boxes and enclosures) and EMI shielding equipment housings.
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iPOLYCOND ECP 9604 properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| EMI Shielding | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Surface Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Volume Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Elongation at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
Optical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Reflection | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Melt Mass-Flow Rate (MFR or MFI = Melt Flow Index or MI = Melt Index) | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Heat Deflection Temperature (HDT) | 0.0 Visible After Login | Visible After Login | Visible After Login |
iPOLYCOND ECP 9604 Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Cylinder Temperature | Visible After Login | Visible After Login | |
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Melt Temperature | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
| Regrind Level | Visible After Login | Visible After Login | |