LNP™ THERMOCOMP™ Compound MC004 by SABIC is a compound based on electrically conductive, PFAS-free, unspecified polypropylene resin that is reinforced with 20% carbon fiber. It exhibits high stiffness & strength. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound MC004 is used in consumer applications like sports, leisures, personal accessory, electrical industry and electronic applications such as mobile phones, computers and tablets.
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Documents related to LNP™ THERMOCOMP™ Compound MC004
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LNP™ THERMOCOMP™ Compound MC004 properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Surface Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Stress | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Yield Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Modulus of Elasticity | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Transverse to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
LNP™ THERMOCOMP™ Compound MC004 Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Back Pressure | Visible After Login | Visible After Login | |
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| Front Zone 3 Temperature | Visible After Login | Visible After Login | |
| Melt Temperature | Visible After Login | Visible After Login | |
| Middle Zone 2 Temperature | Visible After Login | Visible After Login | |
| Rear Zone 1 Temperature | Visible After Login | Visible After Login | |
| Screw Speed | Visible After Login | Visible After Login | |