LNP™ THERMOCOMP™ Compound KF008 by SABIC is a compound based on PFAS-free, acetal (POM) copolymer resin reinforced with 40% glass fiber. It offers high stiffness and strength. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound KF008 is designed for consumer applications such as personal accessory. It is recommended for electronic and electrical industry applications like mobile phones, computers and tablets. It is suitable for building components and constructions.
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Documents related to LNP™ THERMOCOMP™ Compound KF008
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LNP™ THERMOCOMP™ Compound KF008 properties
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Yield Strength | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strain | 0.0 Visible After Login | Visible After Login | Visible After Login |
Other properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Tensile Strength at Yield | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Transverse to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 0.46 MPa (66 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
LNP™ THERMOCOMP™ Compound KF008 Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Back Pressure | Visible After Login | Visible After Login | |
| Drying Temperature | Visible After Login | Visible After Login | |
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| Front Zone 3 Temperature | Visible After Login | Visible After Login | |
| Melt Temperature | Visible After Login | Visible After Login | |
| Middle Zone 2 Temperature | Visible After Login | Visible After Login | |
| Rear Zone 1 Temperature | Visible After Login | Visible After Login | |
| Screw Speed | Visible After Login | Visible After Login | |