LNP™ THERMOCOMP™ Compound AC004 by SABIC is a compound based on PFAS-free, electrically conductive, acrylonitrile butadiene styrene (ABS) resin that is filled with carbon fiber. Provides high stiffness & strength. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound AC004 is used in building components & constructions and consumer applications like personal accessories & sports/leisures. LNP™ THERMOCOMP™ Compound AC004 is suitable for electrical industry and electronic applications such as mobile phones, computers and tablets.
Product family:
Chemical family:
Product Type:
| Bio Based content | Visible After Login |
Documents related to LNP™ THERMOCOMP™ Compound AC004
(2)
Compliance
No data available
Applications
Recommended markets
Conversion mode
Availability
Product Status:Visible After Login
Regional Availability:Visible After Login| Visible After Login| Visible After Login
LNP™ THERMOCOMP™ Compound AC004 properties
Electrical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Surface Resistivity | 0.0 Visible After Login | Visible After Login | Visible After Login |
Mechanical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Elongation at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Modulus | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Flexural Stress | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Notched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Impact Strength, Unnotched Izod | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Tensile Strength at Break | 0.0 Visible After Login | Visible After Login | Visible After Login |
Physical properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Density | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Linear Mold Shrinkage, Transverse | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Moisture Absorption | 0.0 Visible After Login | Visible After Login | Visible After Login |
Thermal properties
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| CTE, Linear, Parallel to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| CTE, Linear, Transverse to Flow | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 0.45 MPa (66 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Deflection Temperature at 1.8 MPa (264 psi) | 0.0 Visible After Login | Visible After Login | Visible After Login |
| Heat Deflection Temperature (HDT), Unannealed | 0.0 Visible After Login | Visible After Login | Visible After Login |
LNP™ THERMOCOMP™ Compound AC004 Processing Guidelines
Injection Molding Processing Guidelines
| Properties | Value & unit | Test condition | Test method |
|---|---|---|---|
| Back Pressure | Visible After Login | Visible After Login | |
| Drying Temperature | Visible After Login | Visible After Login | |
| Drying Time | Visible After Login | Visible After Login | |
| Front Zone 3 Temperature | Visible After Login | Visible After Login | |
| Melt Temperature | Visible After Login | Visible After Login | |
| Middle Zone 2 Temperature | Visible After Login | Visible After Login | |
| Moisture Content | Visible After Login | Visible After Login | |
| Mold Temperature | Visible After Login | Visible After Login | |
| Rear Zone 1 Temperature | Visible After Login | Visible After Login | |
| Screw Speed | Visible After Login | Visible After Login | |